XGSM Iași — Service & Piese GSM

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Model tested and documented at XGSM Iași.

Honor Released 2026 Available

Honor magicpad4

Honor magicpad4 (2026): display Si/C Li-Ion 10100 mAh de 12.3 inches, 443.2 cm 2 (~90.7% screen-to-body ratio), chipset Qualcomm SM8845 Snapdragon 8 Gen 5 (3 nm). Specificații complete, coduri de model și piese compatibile pentru magicpad4 — verifică stocul și prețul la XGSM Iași.

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Complete Technical Specifications

Comms
Positioning No
Bluetooth 6.0, A2DP, LE, aptX HD, aptX Adaptive, ASHA
NFC No
Radio No
Wi-Fi Wi-Fi 802.11 a/b/g/n/ac/6/7, dual-band
USB USB Type-C 3.2, Display Port 1.2, OTG, accessory connector pins
Memory
Card memorie No
Memorie internă 256GB 12GB RAM, 512GB 16GB RAM
Display
Rezoluție 1920 x 3000 pixels (~290 ppi density)
Tip Si/C Li-Ion 10100 mAh
Diagonală 12.3 inches, 443.2 cm 2 (~90.7% screen-to-body ratio)
Sound
Info IMAX Enhanced
Difuzor Yes, with stereo speakers (8 speakers)
Jack 3.5mm No
Launch
Anunțat 2026, February 25
Status Available. Released 2026, March
Body
Greutate 450 g (0.99 lb)
Info Stylus support
Dimensiuni 273.4 x 178.8 x 4.8 mm (10.76 x 7.04 x 0.19 in)
SIM No
Battery
Încărcare 66W wired 5W reverse wired
Platform
CPU Octa-core (2x3.8 GHz Oryon V3 Phoenix L + 6x3.32 GHz Oryon V3 Phoenix M)
Chipset Qualcomm SM8845 Snapdragon 8 Gen 5 (3 nm)
OS Android 16, MagicOS 10
GPU Adreno 829
Network
Tehnologie No cellular connectivity
4G N/A
GPRS No
3G N/A
2G N/A
EDGE No
Sensors and features
Sensors Accelerometer, proximity (accessories only), gyro
Main camera
Single 13 MP, f/2.0, AF
Features LED flash
Video 4K@30fps, 1080p@30fps
Selfie camera
Single 9 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Misc
Colors Gray, White
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Compatible Parts (16)

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